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Switch socket

Detection service / Knowledge of microswitches

Micro switch terminology explanation ---- saa certification
 
 
■General terms
(1) General terms
Micro switch: A switch with a contact structure that has a small contact interval and a snap-action mechanism, performs a switching action with a specified stroke and a specified force, and is covered with a housing with a drive rod on the outside. (Hereinafter referred to as a switch) With contact: Among switch types, compared with a semiconductor switch with switching characteristics, the switch function is achieved by mechanical switching of the contact. Contact form: An electrical input and output circuit that forms a contact according to various uses [shown in (16)].
Rated value: Generally refers to the value that serves as a guarantee benchmark for switch characteristics and performance, such as rated current, rated voltage, etc., which is based on specific conditions (type of load, current, voltage, frequency, etc.).
Resin fixing (plastic-sealed terminals): After wiring the terminal part with a wire, the part is fixed by filling it with resin to eliminate the exposed live parts and improve the drip resistance.
Insulation resistance: refers to the resistance between non-connected terminals, between each terminal and non-conductive metal parts, and between each terminal and ground.
Withstand voltage: The critical value that will not cause insulation damage after applying high voltage to the specified measurement location for 1 minute.
Contact resistance: It indicates the resistance of the contact part of the contact, but generally indicates the resistance value including the spring and the conductor resistance of the terminal part.
Vibration resistance: When a malfunctioning vibration microswitch is in use, the contact closed due to vibration does not separate within the specified time range.
Impact resistance: Durable impact means that the micro switch will not be damaged by mechanical impact during transportation or installation, and the impact will be within the range of the action characteristics.
Misoperation shock refers to the shock range in which the contacts closed by the impact do not separate within the prescribed time when the micro switch is used.
(2) Terms related to structure and construction
 
●Structure and construction of micro switch
 
Picture of micro switch

 

(3) Terms related to life
Mechanical life: refers to the life of a switch when the contacts are not energized and the overtravel (OT) is set to the specified value at a specified operating frequency.
Electrical life: refers to the life of a switch when the rated load is connected to the contacts and the overtravel (OT) is set to the specified value at a specified operating frequency.
(4) Standard test conditions
The test conditions for switches are as follows.
Ambient temperature: 20±2℃, relative humidity: 65±5%RH, air pressure: 101.3kPa
(5) The N level reference value
indicates the failure level at a reliability of 60% (λ60).
λ60=0.5×10-6/times means that the failure rate is less than times at a reliability of 60%.
(6) Shape and type of contacts
(7) Contact spacing
The contact spacing is specified in four types: 0.25mm, 0.5mm, 1.0mm, and 1.8mm. The contact spacing is a design target. If the minimum contact spacing is required during use, please confirm and select. The standard contact spacing is generally 0.5mm. For the same switch mechanism, the smaller the contact spacing, the smaller the MD, the higher the sensitivity, and the longer the mechanical life (lifespan), but it is disadvantageous in terms of DC circuit breaking performance and vibration and impact resistance. Since the current switching of micro switches will cause contact loss, the contact spacing becomes larger, and the sensitivity decreases as the MD increases. Therefore, in order to achieve high sensitivity, when using a micro switch with a contact spacing of 0.25mm, it is necessary to maintain a small switching current to reduce the contact loss caused by current switching. Products with a large contact spacing have good vibration resistance, impact resistance and circuit breaking performance.
For MD (hysteresis distance), please refer to (10) Action Characteristics Terminology (page 745).

shape

name

Main materials used

processing method

The main purpose

 

 

 

 

This is used to obtain stable contact reliability in the micro-load area.
The contact method is orthogonal, and a contact material with excellent environmental resistance such as gold alloy is used.
When particularly high reliability is required, a double crossbar with two crossbars can also be used.

Omron, OMRON, micro switch, principle, what is a micro switch, terminology

Crossbar

Gold Alloy Silver Alloy

Welding
or
riveting

Omron, OMRON, micro switch, principle, what is a micro switch, terminology

Needle

silver

It is used to improve contact reliability in the load range of relay load.
The curvature radius R of the rivet-type contact is reduced to a very small 1mm to increase the contact pressure per unit area.

Omron, OMRON, micro switch, principle, what is a micro switch, terminology

rivet

Silver plated silver silver alloy gold plated

It is widely used in the range from general load to high load.
For fixed contacts, groove processing is often used to remove the products generated by the opening and closing of the switch, and gold plating is often used to prevent the influence of oxidation and sulfurization of the silver contacts.
When switching large currents such as the input switch of a TV, a high-hardness silver alloy is used.



(7) Contact spacing
The contact spacing is specified in four types: 0.25mm, 0.5mm, 1.0mm, and 1.8mm. The contact spacing is the target during design. If the minimum contact spacing is required during use, please confirm and
select. The general standard for contact spacing is 0.5mm. For the same switch mechanism, the smaller the contact spacing, the smaller the MD, the higher the sensitivity, and
the longer the mechanical life (lifespan), but it is disadvantageous in terms of DC breaking performance and vibration and impact resistance. Since the current switching of the micro switch will cause the contact to wear out, the contact spacing becomes larger, and the MD
increases, the sensitivity decreases. Therefore, in order to achieve high sensitivity, when using a micro switch with a contact spacing of 0.25mm, it is necessary to maintain a small switching current to reduce the
contact loss caused by the current switching. Products with a large contact spacing have good vibration resistance, impact resistance and breaking performance.
 

Representing characters

Contact spacing

DC current cut-off

Force and travel

Accuracy and life (lifespan)

Anti-vibration and shock

The main advantage

H

0.25mm

Very small

High precision and long life

G

0.50mm

Small

General use

F

1.00mm

middle

Intermediate characteristics between G and E

E

1.80mm

big

Good vibration and impact resistance

 

: Excellent

Good

○  :Normal

: Bad

(8) Snap-action mechanism
A snap-action mechanism allows the movable contact to move quickly from one fixed contact to another fixed contact, while being as unaffected by the operating speed as possible. For example, even in the case of a knife switch, if the handle is operated quickly, the movement will become faster. However, this mechanism in which the speed of the operating handle is related to the speed of the contact movement is not called a snap-action type, but a slow-action type. The faster the contact switching speed, the shorter the duration of the arc between the contacts.
This results in less wear and tear on the contacts and allows stable characteristics to be maintained. However, in addition to the speed limit (economic speed) that effectively reduces the amount of arcing, there are also limits due to mechanical problems. In particular, if the switching speed is too fast when closing the circuit, the impact energy between the movable contact and the fixed contact will increase, and the jumping phenomenon (vibration or friction closing) caused by the impact will generate an arc, which will seriously wear out the contacts and sometimes fail to open the circuit, causing the contacts to melt. Mechanisms that perform this kind of quick action generally use spring mechanisms with dead points (critical action points when changing from one state to another state in a jumpy manner).
The figure below shows an example of a snap-action mechanism for a micro switch formed by combining a tension spring and a compression spring.

The following is an explanation of the operating principle of a double-throw type (Z) snap-action mechanism.
The figure below shows the relationship of the forces of the switch. In the free position where no external force is applied to the actuator, the reaction force F1 of the compression spring is in a state of equilibrium due to the influence of two forces - F2 and F0. F0 is the pressure that pushes the movable contact c to the fixed contact b.
Next, the actuator applies force to a part of the tension spring to displace the tension spring. At this time, the forces F1 and F2 at point N will increase in sequence, and the angle will approach 180°. Soon, only F1 and F2 will be in a state of equilibrium, that is, F0 = 0. There is
a sliding which will cause the contact to move horizontally and further bend the compression spring. From the position of F0=0, by further applying external force to slightly displace the tension spring, a force in the opposite direction -F0 will be generated, and the movable contact c will be
pressed out from the bottom with the maximum force of the bending compression spring, and the movable contact c will move through the space to the fixed contact a on the opposite side.
Using this operating principle, the microswitch switches the contacts at the inherent switching speed (disengagement speed) of the switch, regardless of the speed at which the external force is generated when the tension spring is pressed. The position when F0=0 is called the operating position, which is
basically .
When the external force is eliminated and the reset operation is performed, it is also based on the same principle, and the bending reaction force of the spring at this time is the reset motive force.

Schematic diagram of the microswitch based on the combination of tension spring and compression spring
Picture of micro switch

(9) Contact resistance·Contact contact force characteristics
The contact resistance changes according to the contact force of the contact, and the following figure shows the relationship. When the contact force of the contact increases, the contact resistance becomes more stable (decreases), and conversely, when the contact force decreases, it begins to become unstable (increases).
Contact resistance·Contact contact force characteristics
Omron, OMRON, micro switch, principle, what is a micro switch, terminology

(10) Terms related to action characteristics

Definition of action characteristics

Classification

term

Abbreviation

unit

Deviation
expression method

definition

Picture of micro switch

force

Operating
Force

OF

N

maximum

The force that must be applied to the drive rod to move from the free position to the actuated position.


Releasing Force

RF

N

Minimum

The force that must be applied to the drive rod to travel from the total stroke position to the reset position

Total travel
force

TTF

N

 

The force that must be applied to the drive rod to travel from the free position to the total travel position

journey


Pre travel

PT

mm,
degree

maximum

The distance or angle of movement from the free position of the drive rod to the actuated position


Over travel

OT

mm,
degree

Minimum

The travel distance or angle from the actuation position of the drive rod to the total travel position


Movement Differential

MD

mm,
degree

maximum

The moving distance or moving angle from the actuating position of the drive rod to the reset position


Total travel

TT

mm,
degree

 

The distance or angle of travel from the free position of the drive rod to the total travel position.

Location

Free
Position

FP

mm,
degree

maximum

The position of the drive rod when no external force is applied

Operating
Position

OP

mm,
degree

±

The position of the driving rod when the driving rod is subjected to external force and the moving contact just starts to reverse from the free position state

Releasing
Position

RP

mm,
degree

 

The position of the driving rod when the external force on the driving rod is reduced and the movable contact just starts to return to the free position from the actuated position.

Total travel
Position

TTP

mm,
degree

 

The position of the drive rod when it reaches the transmission stop position.



Explanation of deviation
(Example) Z-15G-B OF (operating force) 2.45~3.43N
Explanation: This means that the force applied to the driving rod is increased from 0 to 3.43N, and all switches should operate. For the setting of the switch stroke, please refer to "① About the operating stroke setting" on page 750.
(11) Force, stroke, and contact force characteristics The operating characteristics of a micro switch are expressed as force and stroke characteristics. The following figure shows this characteristic. That is, the horizontal axis stroke (actuator stroke) is applied to the vertical axis actuator, and the force applied at this time is obtained. The characteristics of a micro switch are as follows:
① When operating and returning, the force changes rapidly, and the switching sound of the switch is emitted at the same time, which can determine the operating position (OP) and reset position (RP) of the switch.
② Since there is a response difference stroke (MD), even if the operating body of the actuator moves or shakes up and down, one of the fixed contacts in the movable contact is stable, so the movable contact is suitable for mechanical detection switches.
③Since the switching of the contacts is fast, a large current can be switched in a small switch with a short arc connection time when switching current.
The following figure shows the relationship between stroke and contact force. In the free state, as the actuator is gradually pushed in, the contact force will gradually decrease, and when it reaches OP, the contact force will become zero, and the movable contact will reverse from normally closed (NC) to normally open (NO), and contact force will be generated. If the actuator is pushed in again, the contact force on the NO side will increase. When the actuator is reset, the NO side becomes zero, and then contact force will be generated on the NC side.
Picture of micro switch

(12) Contact switching time The relationship between operating speed and contact switching time is shown in the figure on the right. As the operating speed of the actuator gradually slows down, the contact switching time will gradually increase. Therefore, the contact switching time is measured at the specified minimum operating speed. The measurement current in the figure below is specified as follows: the current for the micro switch for micro load is 1mA, and the current for the general purpose micro switch is 100mA. As shown in the figure below, the contact switching time is the sum of the unstable time, reversal time and vibration time. The contact switching time of a general micro switch is 5 to 15msec. Here, the unstable time is caused by the unstable contact resistance, and the unstable contact resistance is caused by the reduction of the contact force before the contact reversal and the friction closure of the contact. The

Picture of micro switch

mechanical reversal of the snap-action mechanism will produce the reversal time. The vibration when the movable contact impacts the fixed contact will produce the vibration time. The unstable time and vibration time will cause the contact to heat up and cause the contact to melt. After connecting to the electronic circuit, it may also cause the electronic circuit to malfunction. Therefore, when designing a micro switch, the unstable time and vibration time should be shortened as much as possible.

Picture of micro switch

Picture of micro switch

(13) Frictional closure of contacts
Depending on the type of snap-action mechanism, some micro switches have almost no frictional closure (sliding) at the contacts. Frictional closure refers to the action of the movable contact sliding on the fixed contact surface under a certain contact force. The following figure shows the frictional closure of the movable contact when it is in motion and when it is reset. Frictional closure has two effects, namely, the cleaning effect on the contact surface and the tripping effect when the contact melts due to impact current, etc.

Picture of micro switch

(14) Terminal symbols and contact shapes

symbol

Terminal Symbols

COM

Common terminal

NC

Normally closed terminal

NO

Normally open terminal


(15) Terminal types
Picture of micro switch

Note: There are also products with lead wires and one-touch connector compatible products whose terminal connection parts are sealed with plastic.


(16) Contact types

Picture of micro switch
 

■About the terminology of EN61058-1 standard
Protection level against electric shock: Indicates the level of protection against electric shock. There are 4 levels as follows.
Class 0: Only basic insulation is used as protection against electric shock.
Class Ⅰ: In addition to basic insulation, grounding is also used to prevent electric shock.
Class II: Double insulation or reinforced insulation is used to protect against electric shock, and grounding is not required.
Class III: As a measure to prevent electric shock, no measures are required to prevent electric shock because a safe extra-low voltage (below 50VAC, or below 70VDC) circuit is used.
Proof Tracking Index (PTI): refers to the anti-leakage index.
It is the maximum withstand voltage value that does not cause a short circuit when 50 drops of a specified solution (0.1% ammonium chloride) are dripped between the electrodes after inserting two electrodes into the test sample. There are five levels as follows. The relationship between the CTI value and PTI in the UL Yellow Book is shown in the following table.

PTI

Classification based on UL Yellow Book

500

PLC level 1 400≤CTI<600 (the material manufacturer must be confirmed to have CTI500 certification)